BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
Διαθεσιμότητα : Σε stock 3 Προϊόν(ντα) Άμεσα Διαθέσιμο
Κωδικός προϊόντος :BST-706
Βάρος και διαστάσεις προϊόντος
Βάρος προϊόντος: 0.5000KG
29,90 €
Χωρίς ΦΠΑ : 24,11 €
Περιγραφή
Specifications
Length | 7.500cm |
---|---|
Width | 6.300cm |
Height | 6.300cm |
Weight | 0.500kg |
Product Description
BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
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Rosin flux is used to facilitate soldering
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It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds
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It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process
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Perfect for mobile phones, PC cards and other sophisticated electronic chip-level flux welding
Package included:
- 1 x BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream