BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream

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Availability: in stock 1 item(s) Άμεσα Διαθέσιμο
Product Code:BST-706

Product Dimensions and Weight

Product Weight: 0.5000KG
29,90 €
Sales price without tax 24,11 €

Description

Specifications

Length 7.500cm
Width 6.300cm
Height 6.300cm
Weight 0.500kg
   

Product Description

BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
  • Rosin flux is used to facilitate soldering

  • It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds

  • It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process

  • Perfect for mobile phones, PC cards and other sophisticated electronic chip-level flux welding

Package included:

  • 1 x BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream

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