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BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
Availability: in stock 2 item(s) Άμεσα Διαθέσιμο
Product Code:BST-706
Product Dimensions and Weight
Product Weight: 0.5000KG
29,90 €
Sales price without tax 24,11 €
Description
Specifications
| Length | 7.500cm |
|---|---|
| Width | 6.300cm |
| Height | 6.300cm |
| Weight | 0.500kg |
Product Description
BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
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Rosin flux is used to facilitate soldering
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It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds
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It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process
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Perfect for mobile phones, PC cards and other sophisticated electronic chip-level flux welding
Package included:
- 1 x BST-706 500g BGA PCB SMD SMT Solder Flux Paste Welding Soldering Tin Cream
